2.2 the process of tin welding mainly includes the following aspects.1) the welding surface is heated to the required temperature.(2) The solder is heated and melted.(3) solder soaking the welding surface. The solder, which is melted after…

Packaging and pin identification of integrated circuits1. Packaging of integrated circuitsThe packaging form of integrated circuit includes circular metal package flat ceramic package double row straight insert plastic package. One-way ana…

1.6.3The naming method of Integrated CircuitsThe method of naming integrated circuits shall be in accordance with the national standards, each model shall consist of the following five parts, each of which is symbolized and defined in Tabl…